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3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

Name: 3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net
Brand: Hhwj
Price: 42046.00 HUF
Availability: InStock

Product ID: 155816460

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Frequently Bought Together

Description

Particle Size:1-10Μm
Usage:Repair For Iphone X
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Particle Size:1-10ΜmUsage:Repair For Iphone X

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Trustpilot

TrustScore 4.5 | 7,300+ reviews

Ayesha M.

The product exactly matches the description. Very satisfied with my purchase.

5 days ago

Reema J.

Perfect platform for hard-to-find items. Delivery was prompt.

1 month ago

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42046 Ft

Duties & taxes incl.

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Trustpilot

TrustScore 4.5 | 7,300+ reviews

Yusuf A.

Fantastic experience overall. Will recommend to friends and family.

1 month ago

Sneha T.

Received my product in pristine condition. Great service overall.

1 month ago

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