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3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

Name: 3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net
Brand: Hhwj
Price: 40908.00 HUF
Availability: InStock

Product ID: 155816460

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Frequently Bought Together

Description

Particle Size:1-10Μm
Usage:Repair For Iphone X
›See more product details

Particle Size:1-10ΜmUsage:Repair For Iphone X

Common Questions

Trustpilot

TrustScore 4.5 | 7,300+ reviews

Vikram D.

The MOLLE sheath is of exceptional quality. Very happy with my purchase.

2 weeks ago

Ayesha M.

The product exactly matches the description. Very satisfied with my purchase.

5 days ago

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40908 Ft

Duties & taxes incl.

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30 daysfor PRO membership users

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Trustpilot

TrustScore 4.5 | 7,300+ reviews

Anita G.

Good experience, but the tracking updates could be better.

2 months ago

Rajesh P.

Customer service was outstanding when I had questions about the product.

2 days ago

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